Opis i karakteristike
Design
Base plate material: Copper
Radiator material: Aluminum
Product colour: Black
Power
Thermal Design Power (TDP): 350 W
Weight & dimensions
Weight: 1.8 kg
Waterblock depth: 7.2 cm
Radiator width: 39.7 cm
Waterblock width: 7.2 cm
Radiator depth: 12 cm
Waterblock height: 5.4 cm
Radiator height: 2.7 cm
Performance
Supported processor sockets: LGA 1156 (Socket H), LGA 1700, LGA 1200 (Socket H5), Socket AM4, LGA 1851, LGA 1155 (Socket H2), LGA 1150 (Socket H3), Socket AM5, LGA 1151 (Socket H4), Intel LGA1851
Quantity per pack: 1 pc(s)
Fan noise level (max): 28 dB
Bearing type: Ceramic bearing
Type: Liquid cooling kit
Fan noise level (min): 18 dB
Pump connector: 3pin
Airflow: 76 m/h
Pump motor speed: 2400 RPM
Suitable location: Processor
Fan diameter: 12 cm
Pump noise level: 28 dB
Promjena cijene
Trenutno najbolja ponuda:
101,10 € u Tia mobiteli
Recenzije korisnika